基于FC-770的板翅式液冷冷板的热设计与热分析

Study on Thermal Design and Thermal Analysis of Liquid Cooling Plate with FC-770

摘要:

为满足大功率机载电子设备当今越来越高的散热需求，文中设计了一种基于液冷工质FC-770的板翅式液冷冷板主动散热技术；为了强化该冷板的换热能力，在冷板工质流动的槽道增加了强化换热的翅片设计；为验证该冷板的散热能力，采用CFD数值模拟技术对所设计的板翅式液冷冷板进行了热分析计算，分别针对五种不同工质进口温度工况开展了热仿真与热模拟工作，并对数值仿真计算结果进行了有效分析。依据数值仿真计算结果的显示，针对机载大功率电子设备所设计的板翅式液冷冷板可以有效控制电子设备温度在55℃以下，温度均匀性优于3℃，满足当前机载电子设备的散热需求；文中提出的散热方案和研究结果具有工程应用价值，为大功率机载电子设备热控系统的设计和数据提供有力支撑。

Abstract:

For thermal dissipation of high-power on-board electronic equipment, a liquid cooling plate with FC-770 has been designed in the current paper. Fin chips has been designed into the channel of the liquid cooling plate, aiming to improve the heat dissipated capability. The CFD method has been used to simulate the thermal characteristics of the designed liquid cooling plate under variable working conditions with different inlet-temperatures of working fluid. Thermal analysis has been carried out as well. The results show that the working temperature of electronic equipment can be controlled under 55℃, in addition, the temperature uniformity of the liquid cooling plate is better than 3℃. The current study could be helpful for the design and data-applied of the thermal control system of the high-power on-board electronic equipment.