一种激光选区BGA型芯片智能温控返修系统

Realization of a BGA Chips Repair System based on Intelligent Temperature Control ofLaser Selected Areas

摘要:

针对手机主板高密度器件布局环境下热风加热BGA型芯片返修控制系统的局限性,研发了一种激光选区BGA型芯片智能温控返修系统。以固高GTN卡为核心,结合红外测温仪、三段式传动装置、威图相机、光纤激光器与电机平台等设计了温度采集单元、电机控制单元、影像定位单元与激光控制单元；基于Windows开发系统,采用MFC技术设计了上位机检测与控制软件系统。采用了激光选区精准加热关键技术与模糊PID控制算法,实现了返修过程的实时检测与电机、温度、激光的实时控制。实验结果表明,该系统激光选区温控精度高,具有操作简单、时延短与稳定性高等优点,具有良好的推广价值。

Abstract:

To solve the limitations of the hot-air heating BGA chip repair control system in the high-density device layout environment of the mobile phone motherboard, a BGA Chips Repair System based on intelligent temperature control of laser selected areas is studied. Firstly, the Googol GTN card is chosen as the core control unit by combined with an infrared thermometer, three-stage transmission, a Vertu camera, a fiber laser and motor platform to design temperature acquisition unit, motor control unit, image positioning unit and laser control unit. Secondly, the upper computer detection and control software system is developed by using MFC technology in Windows operating system. Then, a fuzzy PID control algorithm of laser selective heating is designed to detect and control of motor, temperature and laser. Finally, experimental results show that the proposed system has high precision in temperature control of laser selected areas, and has the advantages of simple operation, short time delay and high stability, which has a good popularization value.