抗辐照相变存储器芯片温度适应性研究

Research on Temperature Adaptability of Phase Change Memory Chip

摘要:

分析了相变存储器应用于航天器时应该考虑的高低温可靠性,并设计实验研究镁光公司研发推出的低功耗相变存储芯片LPDDR2-PCM MT66R7072,以评估其空间应用的可行性。实验结果显示：在-40℃~80℃范围下,相变存储芯片能够正常实现读写操作,在25℃下,待机功耗为9.792mW,最大工作功耗为36.474mW,相对现役空间存储器,表现出明显的低成本、低功耗和高可靠性等优势。

Abstract:

This paper analyzes the spatial radiation effects and wide temperature reliability that phase change memory should be considered in spacecraft, and a series of experiments are designed to evaluate its space application on LPDDR2-PCM MT66R7072, a low power phase change memory chip was developed by Micron in 2012. The experimental results show that the phase change memory chip can realize the read and write operation normally in the range of -40 ℃ ~ 80 ℃. At 25 ℃, the standby power consumption is 9.792mW and the maximum working power is 36.474mW. Comparing to existing spatial memory, that phase change memory shows significant advantages of low cost, low power consumption and high reliability.