ka频段片式一体化发射组件的设计与实现

Design of a ka Band Integrated Tile-type Transmit Module

摘要:

介绍了一种ka频段片式一体化发射组件的研制方法和关键技术。为满足一体化片式组件小型化且工作频率高的要求,提出了一种集成天线辐射单元与射频模块三维垂直互联的方法,同时结合多功能芯片 (MFC)技术、多芯片组装(MCM)技术实现组件高密度集成。研制的一体化组件尺寸为48 mm×48 mm×6.3 mm、质量不超过100g,集成16个发射通道,每个通道包含6位数控移相器和5位数控衰减器。该组件集成度高、较传统组件在尺寸和重量上具有较大的优势。

Abstract:

Design method and key technologies of a ka-band integrated tile-type transmit module are given. In order to meet the requirements of small size, high operation frequency, a new method of vertical interconnection technology is proposed, and the multi-functional chip (MFC) technique and multi-chip module(MCM) technique are also adopted to increase the integration level. Finally, a tile-type transmit module with 16 transmit channels has been developed successfully. The tile-type module features high integration level, has more advantages on the size and weight than the conventional module.