基于FPGA的BGA焊点健康管理原理与实现

Theory and implementation of BGA solder joint health management based on FPGA

摘要:

针对BGA封装的FPGA焊点故障频发的问题,提出了一种基于FPGA的BGA焊点失效监测模型及实现方法；对FPGA的BGA焊点失效原理进行了分析；基于IPC7095B确定了焊点易失效区域,并依据欧姆定律构建了检测模型；基于Xilinx的FPGA实现了对焊点健康信息的管理,并根据不同的检测标准对检测情况进行了比较

Abstract:

For the question of frequency occurrence of solder joint failure for FPGA BGA package, presents a FPGA-based BGA solder joint failure monitoring model and implementation; analysis of the FPGA"s BGA solder joint failures principle; specify the solder area prone to failure based IPC7095B, and constructed in accordance with Ohm"s law detection model; based on Xilinx FPGA implementation of health information management for joints, and different testing standards were compared.