BGA封装FPGA焊点失效故障诊断系统设计

Design of Detecting System of Solder joint Faults of BGA Package FPGA

摘要:

针对BGA(Ball Grid Array)封装FPGA(Field Programmable Gate Array)焊接点连接失效的故障诊断问题,提出了一种故障检测系统设计方案；该方案分别从焊点级、芯片级和系统级故障诊断3个层次构建故障检测系统；方案基于Altera公司的DE2硬件平台构建单个焊点健康信息提取IP核；针对芯片焊点众多,难以全部监控的问题采用Canary故障检测法监测4个角落的敏感焊点的健康信息；敏感焊点的健康信息经菊花链式通信链路实现了不同FPGA芯片之间的信息互联,完成整个系统的焊点健康信息整合。

Abstract:

Aim at detecting Ball Grid Array(BGA) solder-joint faults of FPGA, this paper proposed a design solution of malfunction detecting system. This system consist of solder-joint-level,core-level and systematic-level malfunction detecting. Based on the Alter DE2 hardware platform to design the IP core of solder joint detecting, detecting the sensitive solder-joints through the ways of Canary to solve the difficulty of all-solder-joints detecting. Make all the FPGA's in daisy chain for congregate their health information.